孙立成

个人信息Personal Information

教授

博士生导师

硕士生导师

主要任职:无

其他任职:精细化工国家重点实验室副主任、大连理工大学-瑞典皇家工学院分子器件联合研究中心主任

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:化工学院

学科:应用化学. 精细化工

办公地点:大连理工大学西部校区化工实验楼E-223

联系方式:0411-84986493

电子邮箱:sunlc@dlut.edu.cn

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Boosting the efficiency and the stability of low cost perovskite solar cells by using CuPc nanorods as hole transport material and carbon as counter electrode

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论文类型:期刊论文

发表时间:2016-02-01

发表刊物:NANO ENERGY

收录刊物:SCIE、EI、ESI高被引论文

卷号:20

页面范围:108-116

ISSN号:2211-2855

关键字:Copper phthalocyanine nanorod; Carbon counter electrode; Hole transport material; Perovskite solar cell

摘要:Low temperature printable carbon cathode based perovskite solar cell was for the first time interfacial engineered with dopant free, nanorod-liked copper phthalocyanine (CuPc) to facilitate charge transportation. Both the CuPc and low temperature processed carbon are potentially noble metal-free and highly stable. By incorporating CuPc nanorods as hole-selective contact material, together with the printable low temperature processed carbon as cathode material, considerably high power conversion efficiency (PCE) of 16.1% was successfully obtained, which is comparable to or even a little higher than the device with state-of-the-art doped spiro-OMeTAD as HTM and noble metal Au as back electrode. Moreover, dramatically enhanced durability relative to doped-spiro-OMeTAD/Au based device was demonstrated by this newly developed device. Detailed excellent capability in accelerating charge extraction and suppressing charge recombination can be disclosed with steady state and time-resolved photoluminescence analysis and electrochemical impedance spectroscopy. To the best our knowledge, this is the highest efficiency that has been reported for PSCs based carbon counter electrode. The work presented here demonstrates an important step forwards to practical applications for PSCs, as it paves the way for developments of cost-effective, stable but still highly efficient PSCs, and offers the promise for a low-cost, mass-manufacturable technology that is compatible with current large-scale printing infrastructure. (C) 2015 Elsevier Ltd. All rights reserved.